摘要
在合成酚醛树脂的过程中引入有机硅预聚物和硼酸,制得硼硅酚醛树脂,并在此基础上加入正硅酸乙酯,原位水解生成SiO 2,进一步改性了硼硅酚醛树脂。分别考查了有机硅预聚物、硼酸和正硅酸乙酯加入量对改性酚醛树脂粘接强度的影响。通过IR考查了改性树脂的结构,硼氧键和硅氧键成功地引入到酚醛树脂中。还通过DSC和不同条件下粘接强度的测试考查了改性树脂的固化性能,确定了其固化工艺。空气气氛中的热重分析则表明改性酚醛树脂初始分解温度为475℃,1 000℃残炭率为21%,耐热性明显优于普通酚醛树脂。
The boron- and- silicone-containing phenolic resin（BSPR） was prepared by introducing organic silicon prepolymer and boric acid during synthesis process of the phenol resin,and then the BSPR was further modified with SiO2 formed by in-situ hydrolysis of introduced tetraethyl orthoslicate（TEOS）.The effect of contents of the silicone prepolymer,boric acid and TEOS on the shear strength was studied.The structure of resin was characterized by infrared spectroscopy,and from the results we can know that the B-O and Si-O bonds were introduced into the phenolic resin successfully.The curing properties and the curing process were investigated by DSC and the test of adhesion strength, respectively.The thermal analysis （TGA） showed that the modified phenolic resin has outstanding heat-resistance,its initial decomposition temperature is 475℃,the carbon yield is 21% when the temperature reaches 1 000℃.
出处
《粘接》
CAS
2014年第4期34-39,共6页
Adhesion
关键词
硼硅酚醛树脂
有机硅预聚物
硼酸
SIO2
boron- and- silicone-containing phenolic resin
silicone prepolymer
boric acid
SiO2
作者简介
薛刚（1984-），男，硕士，助理研究员，主要从事耐高温胶粘剂及密封胶的研究。E-mail：qingnihuida@126.com。
