摘要
优化高速度、高可靠的精密制造,必须深入理解制造装备进行的工艺过程的原理和细节。超声键合是复杂物理、力学作用下的封装过程,使金属材料在微米和毫秒时空中形成界面键合。2003年以来,中南大学课题组,在国家"973"计划项目的支持下,进行了超声键合机理的相关研究,获得深入的理解和工艺优化方向的认识。本文回顾了封装的发展,介绍了科学问题的产生,以及所使用的键合动力学研究手段。
Optimizing a high speed, reliablible, accurate man- ufacturing process begins with a clear understanding of the detaisls of process principle. Ultrasonic and ther- mosonic bonding by automatic equipments, a packaging process driven by complicated physical and mechanical interactions, make a strength formation between two met- als at the sub-micron scale within the milliseconds range. The authors＇group at Central South University, established in 2003 under the support by the China De- partment of Science ＆ Technology Progect 973, has been doing related studies on bonding mechanism for in- depth process know-why and know-how. This paper re- views the progress of microelectronics packaging, sci- ence challenges and research methods used in bonding dynamics.
出处
《中国基础科学》
2013年第3期14-26,F0002,F0003,共15页
China Basic Science
基金
973计划项目(2003CB716202
2009CB724203)
关键词
超声键合
微电子封装
键合动力学
973计划
ultrasonic and thermosonic bonding
micro-electronics packaging
bonding dynamics
Project 973
作者简介
韩雷，教授，leihanxyz@yahoo．com．cn．
