摘要
综述了热障涂层应力数值模拟类研究的现状。在此基础上,总结归纳了数值模拟类研究的三个关键性问题:热生长氧化物、材料非线性特性、涂层应力状态与失效机理的内在联系。分别探讨了热生长氧化物的生成对于涂层系统内部应力以及失效模式的影响;涂层蠕变特性对于涂层系统内应力的缓解机制;对比分析了APS/EB-PVD两种不同制备方法所制备的热障涂层的失效模式,总结归纳了涂层系统应力状态与其失效机理的内在联系。最后,探讨了当前传统8YSZ热障涂层的发展瓶颈,明确了未来热障涂层的发展将落在探索新型低热导率隔热材料、探索合理的热障涂层体系两个方面。着重介绍了新型双陶瓷层热障涂层,总结了双陶瓷层热障涂层几个重要的研究问题。对于研究新型热障涂层的应力状态及其失效行为、优化涂层结构,有限元数值模拟仍是一种重要的研究手段。
The research of failure behavior and stress in failure process of thermal barrier coating is always emphazed in studying the failure of thermal barrier coating.On the base of review of the current state of numerical simulation of stress,three key issues of thermally grown oxide,nonlinear characteristics of materials,internal relations between stress state and failure mechanism were reviewed in this paper.The questions of the influence on internal stress and failure mode of the coating system through the formation of thermally grown oxide and the stress relief mechanism of the creep characteristics of coating were discussed separately.At last,on the basis of the results of numerical simulation and the results of experimental observation,the failure modes of thermal barrier coating made by APS/EBPVD were comparative summarized.In the last part of present paper,the development bottleneck of the traditional 8YSZ TBC was described.In the future,the research will be more focused on exploring new ceramics with lower thermal conductivity,and exploring reasonable structure of the coating.The new coating system （the double-ceramic-layer thermal barrier coating）was introduced and discussed.The numerical simulation is still an important approach in studying the stress state and failure behavior of the new coating,and also in optimizing the structure of the coating.
出处
《航空材料学报》
EI
CAS
CSCD
北大核心
2013年第5期83-98,共16页
Journal of Aeronautical Materials
基金
国家重点基础研究发展计划资助项目(61311203B)
关键词
热障涂层
应力
失效
数值模拟
热生长氧化物
thermal barrier coating
stress
failure
numerical simulation
thermal growth oxide
作者简介
韩萌（1987-）,男,博士研究生,主要从事热障涂层力学行为的研究,（E-mail）jjjayren@163.com
通讯作者：黄继华，男，教授，（E—mail）jihuahuang47@sina.com
