摘要
采用氨基乙酸、抗坏血酸、硫脲和柠檬酸三钠4种配位体系镀液电沉积制备Cu–Cr合金。通过测定循环伏安曲线和线性扫描伏安曲线,研究了不同镀液的电化学行为。氨基乙酸体系镀液最适用于制备Cu–Cr合金,采用该配方制得的Cu–Cr合金中Cr含量高达18.63%,10A/dm2下电镀10min所得镀层厚度为25μm,表面平整,呈光亮的金黄色,结合力好,相对导电率达68.2%,导电性基本满足触头材料要求。
Cu-Cr alloy was prepared by electrodeposition respectively from 4 kinds of electrolytes containing different complexing agents i.e. glycine, ascorbic acid, thiourea, and trisodium citrate. The electrochemical behaviors of different electrolytes were studied by cyclic voltammetry and linear scanning voltammetry. The electrolyte with glycine as complexing agent is most suitable for electrodeposition of Cu-Cr alloy. The Cu-Cr alloy coating obtained therefrom at 10 A/dm2 for 10 min features Cr content up to 18.63%, thickness 25 μm, smooth and bright golden yellow surface, strong adhesion, and relative conductivity 68.2%. The conductivity of the Cu-Cr alloy coating basically meets the demand of contact materials.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2013年第8期4-7,共4页
Electroplating & Finishing
关键词
铜-铬合金
电沉积
配位剂
氨基乙酸
电化学
导电性
copper-chromium alloy
electrodeposition
complexing agent
glycine
electrochemistry
conductivity
作者简介
作者简介：滕莹雪（1979-），女，辽宁鞍山人，博士，主要从事有色金属材料研究。作者联系方式：（E-mail）tengyingxue_2007@163．tom。
