摘要
随着电子产品集成化程度的提高,功率器件及大规模集成电路的散热问题越来越突出。在设计电子产品时,常常利用导热硅脂来帮助实现发热器件和散热板间有效的热传导,从而起到热量散放的作用。文中对所选型的数种导热衬垫与导热硅脂进行了性能对比测定,通过热阻性能试验、耐溶剂试验、三防漆涂覆试验、耐低温性能试验等试验方法对其性能进行了判定,并分析了在印制板组件上用导热衬垫代替常用的导热硅脂材料的可行性。
With increasing integration of electronic products, the heat dissipation problem of the power device and the largescale integrated circuits （LSIC） becomes more and more prominent. In electronic product de sign, the thermal grease is usually used to realize effective heat conduct from heating device to cold plate and thereby to realize heat dispersion. The performances of the selected thermal conductive pad and thermal grease are tested and compared first in this paper. Then these performances are judged through thermal resistance test, solvent resistance test, conformal coating paint test and low temperature resistance test. The feasibility of replacing thermal grease with thermal conductive Dad on PCB assemblies is analvzad tnn
出处
《电子机械工程》
2013年第3期50-52,64,共4页
Electro-Mechanical Engineering
关键词
导热衬垫
导热系数
接触热阻
总热阻
thermal conductive pad
thermal conductivity
thermal contact resistance
total thermal resistance
作者简介
答邦宁（1964-），男，工程师，主要从事电子装联工艺工作。
