摘要
在HCO_3^-浓度为0.08 mol/L及不同浓度配比的SO_4^(2-)和Cl^-混合溶液中,利用循环极化电化学测试方法和SEM,对Cu工作电极的循环极化行为和点蚀表面形貌进行了系统的研究.结果表明,SO_4^(2-)或Cl^-均能促进Cu的阳极溶解,且二者间存在交互作用.Cl^-能降低Cu电极的腐蚀电位,增强其电化学活性.在点蚀敏感区域图中,Cu发生点蚀的临界Cl^-浓度为0.02 mol/L.当Cl^-浓度较低时,SO_4^(2-)对点蚀敏感性无影响;当Cl^-浓度为中等时,SO_4^(2-)抑制点蚀;当Cl^-浓度较高时,SO_4^(2-)使Cu点蚀敏感性先升高后降低.无论SO_4^(2-)浓度的高低,Cl^-都能促进点蚀.在本研究体系中,Cu的点蚀敏感性强烈地受到Cl^-和SO_4^(2-)的影响.
In this work, the pitting corrosion behavior of Cu in the mixed solution of HCO3, C1- and SO2- simulating groundwater was investigated by means of cyclic polarization test and SEM microscopy. The results showed that both S04-2 and C1- can synergistically promote the anodic dissolution of Cu electrode. C1- can decrease the corrosion potential of Cu to enhance its electrochemical activity. The plot of pitting sensitivity of Cu showed that the pitting critical concentration of C1- was 0.02 mol/L. When the concentration of C1- was low, S04-2 did not affect the pitting susceptibility; when the concentration of C1- was in the middle, SO2- strongly inhibited the pitting corrosion of Cu; when the concentration of C1- was high, the pitting susceptibility will first increase and then reduce with increasing the concentration of SO2-. Regardless of what concentration of S04-2, C1- can pro- mote the pitting corrosion of Cu. In the current solution system, it is found that the pitting corrosion of Cu was sorely sensitive to SO2- and C1-.
出处
《金属学报》
SCIE
EI
CAS
CSCD
北大核心
2013年第2期207-213,共7页
Acta Metallurgica Sinica
基金
国家自然科学基金资助项目51071160~~
作者简介
王长罡，男，1985年生，博士
