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一种新型LED模块COB封装结构设计 被引量:8

A Novel COB Package Structure for LED Module
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摘要 根据目前市场上LED模块COB的封装结构特点以及相关研究结果,提出了一种新型COB自由曲面透镜封装结构方案。通过封装由特殊计算得到的自由曲面透镜阵列,不仅避免由于出光界面的全反射的发生,还能实现特定的光学分布。根据光源辐射特性以及器件的出射光学分布,利用能量守恒定律以及Snell方程建立方程组,运用龙格-库塔法求解得到自由曲面数据。采用Tracepro软件对所设计的结构进行仿真,模拟结果表明,器件实现特定的光学分布,同时结构的出光效率高于90%。 According to the characteristics of current COB package structural,as well as related research results,a novel COB package structure for LED module is proposed based on matrix free-form lenses and spray technology.By encapsulating matrix free-form lenses,the total reflection angle on the air-silicone interface is avoided and a specific light distribution is achieved.In order to achieve uniform illumination on the target surface,differential equations are created by Snell equation and the law of conservation of energy based on the intensity distribution of the light source.Numerical method is applied to solve the equations and 3D model is created from the calculated results.The structure is simulated by Tracepro.From the result of simulation,the uniform illumination on the target surface is achieved and the optical efficiency of the structure higher than 90%.
出处 《电子与封装》 2012年第12期5-8,共4页 Electronics & Packaging
关键词 COB 封装结构 自由曲面透镜 光学设计 COB package structure free-form lens optical design
作者简介 李伟平(1977-),男,广东梅州人,工程师,主要从事LED器件及半导体照明技术研究工作。
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  • 1陈宇,黄帆,严华锋,殷录桥,张建华,李志君.通过加速老化实验对LED器件可靠性的研究[J].照明工程学报,2011,22(S1):34-38. 被引量:7
  • 2苗丽霞.浅析惠斯登电桥在称重传感器中的应用[J].甘肃冶金,2004,26(4):52-54. 被引量:10
  • 3李炳乾.基于金属线路板的新型大功率LED及其光电特性研究[J].光子学报,2005,34(3):372-374. 被引量:32
  • 4LED applications.US Department of Energy(DOE)[EB/OL].(2014-04-27)www.ssl.energy.gov.
  • 5MORENO I,AVENDANO-ALEJO M,TZONCHEV R I.Designing light-emithing diade arrays for uniform nearfield irradiance[J].ApplOptics,2006,45(10):2265-2272.
  • 6Wood D.Optoelectronic semiconductor devices[M].UK:PrenticeHall International,1994:60-80.
  • 7WU Hsueh-Han,LIN Kuan-Hong,LIN Shun-Tian. A study on the heat dissipation of high power multi-chip COB LEDs[J].Microelectronics Journal,2012,(04):280-287.
  • 8SIM Jae-Kwan,K.Ashok,RA Yong-Ho. Characteristic enhancement of white LED lamp using low temperature co-fired ceramic-chip on board package[J].Current Applied Physics,2012,(02):494-498.
  • 9Chang Keun Lee,Jung Keun Ahn. Thermal analysis of LED lamp with LTCC-COB package[J].MICROELECTRONICS INTERNATIONAL,2013,(01):3-9.
  • 10YU Hui,SHANG Jintang,XU Chao. Chip-onboard (COB) wafer level packaging of LEDs using silicon substrates and chemical foaming process (CFP)-made glassbubble caps[A].2011.133-136.

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