摘要
目前,少有Cu-Ni-P合金电沉积的研究报道,为此,采用电沉积法制备了Cu-Ni-P镀层,通过循环伏安法考察了铜在Cu-Ni-P镀液中的电化学行为,在此基础上,采用恒电位电沉积法在柠檬酸体系中制备了Cu-Ni-P三元合金镀层,并对镀层的形貌和硬度进行了表征。结果表明:不能单独与铜共沉积的非金属元素P,在一定的工艺条件下,通过在有铜离子的溶液中与镍的诱导共沉积,可以与铜形成Cu-Ni-P合金镀层;Cu-Ni-P合金镀层形貌良好,硬度比Cu镀层有显著提高。
The electrochemical behavior of Cu in Cu-Ni-P electroplating bath was investigated by cyclic voltammetry.Then Cu-Ni-P ternary alloy coating was prepared by potentiostatic electrodeposition in a citric acid-type plating bath.The morphology of as-obtained alloy coating was observed,and its hardness was measured.Results show that,although non-metallic element P can not be directly co-deposited with copper,it can be induced to co-deposit with Ni in a solution containing Cu2+,Ni2+ and H2PO-2 ions yielding Cu-Ni-P ternary alloy coating.As-obtained Cu-Ni-P alloy coating has good surface morphology,and its hardness is much higher than that of electrodeposited Cu coating.
出处
《材料保护》
CAS
CSCD
北大核心
2012年第11期10-12,3,共3页
Materials Protection
基金
科技部国际合作项目(2009DFA62700)资助
关键词
Cu—Ni—P合金电沉积
恒电位电沉积
诱导共沉积
镀层硬度
electrodeposition of Cu-Ni-P alloy coating
potentiostatic electrodeposition
induced codeposition
hardness
作者简介
[通信作者]王为（1961一），教授，从事电沉积功能材料的研究，电话：022—27409483。E-mail：wwangg@tju．edu．cn
