摘要
为了探讨磁场作用下电铸工艺参数对单面覆铜板表面铸层显微形貌的影响,以铸层的显微硬度为指标,采用正交试验优选了微电铸工艺参数,探讨了磁场强度、电流密度以及超声功率对铸层表面形貌的影响规律,确定了磁场作用下制备高硬度且铸层平整、致密的最优工艺参数。结果表明:施加磁场后,金属离子受到磁流体力学效应对电铸过程产生影响;随着磁场强度的增大,铸层晶粒逐渐得到细化,形状更加规则;随着电流密度、超声功率的增大,铸层晶粒均呈现出先细化后粗化的规律。磁场强度0.6 T、电流密度2 A/dm2、超声功率240 W、占空比20%下所得铸层晶粒粒径均匀,表面平整致密,显微硬度较高,具有良好的综合性能。
The optimized process parameters for microelectroforming of single-side copper cladding plate under magnetic field were determined by orthogonal test with microhardness of the microelectroforming coating as a criterion.The effects of magnetic intensity,current density as well as ultrasonic wave power on the surface morphology of the microelectroforming coating were investigated.The optimized parameters for preparing smooth and compact microelectroforming coating with high microhardness were established.Results indicate that metallic ions undergo magnetic hydrodynamic effect under the action of external magnetic field thereby affecting the electroforming process.With the increase of the magnetic field intensity,the grain size of the microelectroforming coating is gradually refined,and its shape tends to be more regular.Besides,with the increase of the current density and ultrasonic wave power,the grains of the microelectroforming coating are initially refined but later coarsened.The microelectroforming coating prepared under a magnetic field intensity of 0.6 T,pulse average current density of 2 A/dm2,ultrasonic wave power of 240 W,and duty cycle of 20% is smooth and compact and possesses high microhardness and good comprehensive properties.
出处
《材料保护》
CAS
CSCD
北大核心
2012年第9期48-51,8,共4页
Materials Protection
基金
国家自然科学基金项目(50975034)
辽宁省科技计划项目(2010223006)资助
关键词
微电铸
磁场
单面覆铜板
工艺参数
表面形貌
晶粒尺寸
显微硬度
microelectroforming
magnetic field
single-side copper cladding plate
process parameters
surface morphology
grain size
microhardness
作者简介
[通信作者]吴蒙华（1963-），教授，博士生导师，主要研究方向为电化学加工技术，电话：0411—87402147，E—mail：wmh005@163．com
