摘要
We have developed an alkaline barrier slurry （named FA/O slurry） for barrier removal and evaluated its chemical mechanical planarization （CMP） performance through comparison with a commercially developed barrier slurry. The FA/O slurry consists of colloidal silica, which is a complexing and an oxidizing agent, and does not have any inhibitors. It was found that the surface roughness of copper blanket wafers polished by the FA/O slurry was lower than the commercial barrier slurry, demonstrating that it leads to a better surface quality. In addition, the dishing and electrical tests also showed that the patterned wafers have a lower dishing value and sheet resistance as compared to the commercial barrier slurry. By comparison, the FA/O slurry demonstrates good planarization performance and can be used for barrier CMP.
We have developed an alkaline barrier slurry （named FA/O slurry） for barrier removal and evaluated its chemical mechanical planarization （CMP） performance through comparison with a commercially developed barrier slurry. The FA/O slurry consists of colloidal silica, which is a complexing and an oxidizing agent, and does not have any inhibitors. It was found that the surface roughness of copper blanket wafers polished by the FA/O slurry was lower than the commercial barrier slurry, demonstrating that it leads to a better surface quality. In addition, the dishing and electrical tests also showed that the patterned wafers have a lower dishing value and sheet resistance as compared to the commercial barrier slurry. By comparison, the FA/O slurry demonstrates good planarization performance and can be used for barrier CMP.
基金
Project supported by the Major National Science and Technology Special Projects(No.2009ZX02308)
the National Natural Science Foundation of China(No.10676008)
the Tianjin Natural Science Foundation of China(No.10JCZDJC15500)
the Fund Project of Hebei Provincial Department of Education,China(No.2011128)
作者简介
Corresponding author:王辰伟,Email:cwtjy206@163.com
