摘要
针对微流控芯片模内键合的动作要求,设计了浇注系统,并进行了微流控芯片流动平衡的充填仿真研究,对模具的浇注系统的尺寸进行了优化,研究结果表明:盖片的浇口尺寸对流动平衡的影响非常小,基片分流道高度对流动平衡影响较显著。随着基片分流道高度的减小,基片与盖片的充填时间越来越接近,当基片分流道高度降至1.5mm时,基片与盖片的充填时间只相差0.003 1 s,流动不平衡率仅有2.5%。
In this study, the runner system of the mold was designed according to the specific functions of the in-mold bonding and the size was optimized. The filling simulation study on the flow balance for microfluid chip injection molding was processed. The simulation results showed that the gate size of the cover cavity had little effect on flow balance while the runner height of the substrate cavity exerted a significant effect on flow balance. It was further revealed that the filling time for cover and substrate cavity became closer when the runner height of the substrate cavity decreased, and that a filling time difference of only 0. 003 1 s, corresponding to a flow imbalance of 2. 5%, was achieved when the runner height of the substrate cavity reduced to 1.5 mm.
出处
《塑料工业》
CAS
CSCD
北大核心
2011年第12期45-48,共4页
China Plastics Industry
关键词
微流控芯片
注射成型
流动平衡
浇注系统
Microfluid Chip
Injection Molding
Flow Balance
Runner System
作者简介
李凯，男，1982年生，硕士研究生，从事聚合物先进制造技术工艺方面的研究。
联系人jby@csu．edu．cn
