期刊文献+

全分布式车身电器系统的附加成本模型 被引量:2

Additional cost model for a complete-distributed automotive-body electrical/electronic system
在线阅读 下载PDF
导出
摘要 成本是推广全分布式车身电器系统的主要制约因素。该文提出一种全分布式电器系统结构,建立了与之相关的附加成本模型,包括线束成本模型和控制器成本模型。对一辆国产客车的车身电器系统进行全分布式改造设计,利用该模型,对线束材料、人力、控制器等关键成本因素进行了分析,验证成本模型的有效性。该模型预测的结果表明:对于未来全分布式汽车电器系统,考虑到一方面铜材、人力价格会上涨,另一方面电子器件成本将降低;因此,总体附加成本不仅可以达到平衡,而且可比现有的分布式系统低。 Cost is the main obstacle for use of completely distributed automotive body electrical systems. A complete-distributed electrical/electronic system architecture was proposed and a related additional cost model was established, which consists of a harness cost model and an electronic control unit cost model. The electrical system was applied to an urban shuttle bus to analyze the cost of harness material, labor, and control unit. The proposed model proves to be effective. The results predicted using the model show that, for the completely distributed electrical system in future, on one hand, the cost of copper and labor will increase, and on the other hand, the cost of electronic devices will decrease with time. Therefore, the additional cost will not only reach its balance, but will be lower than that of the existing systems.
出处 《汽车安全与节能学报》 CAS 2011年第4期356-362,共7页 Journal of Automotive Safety and Energy
基金 汽车安全与节能国家重点实验室开放基金(KF10192) 同济大学青年人才培养行动计划(2010KJ039) 工信部电子信息产业发展基金(内部)
关键词 车身电器系统 全分布式设计 成本模型 成本分析 automotive body electrical/electronic system complete-distributed design cost model cost analysis
作者简介 张新丰(1980-),男(汉),浙江,讲师。E-mail:zhangxinfeng@tongji.edu.cn 通讯作者:连小珉,教授。E-mail:lianxm@tsinghua.edu.cn
  • 相关文献

参考文献3

二级参考文献20

  • 1黄先进,蒋晓春,叶斌,郑琼林.智能化IGBT驱动电路研究[J].电工技术学报,2005,20(4):89-93. 被引量:27
  • 2Leen G, Heffernan D, Dunne A. Digital networks in the automotive vehicle [J]. Computing & Control Engineering Journal, 10(6):257-266.
  • 3Robert Bosch GmbH. CAN specification[S]. Version 2.0, September 1991.
  • 4International Organization for Standardization. ISO 11898-1 2003-Road vehicles-Controller area network (CAN)--Part 1: Data link layer and physical signaling [S]. November 2003.
  • 5LIN Consortium. LIN Specification 2.0, 2003.
  • 6Elmenreich W, Krywult S. A comparison of field bus protocols: LIN 1.3, LIN 2.0 and TTP/A [C]//10th IEEE Conference on Emerging Technologies and Factory Automation. Catania, Italy: 19- 22, Sept. 2005, 1: 747 - 753.
  • 7Liao Y N, Yang D G, Lian X M. Global electric electronic system in vehicle [C]//Proceedings of 2006 IEEE International Conference on Vehicular Electronics and Safety Conference. Shanghai, China, 2006 : 265 - 269.
  • 8Leen G, Heffernan D, Dunne A. Digital networks in the automotive vehicle[J]. Computing & Control Engineering Journal, 1999, 10(6): 257-266.
  • 9Mark E Russell. Integrated automotive sensors[J]. IEEE Transaction on Microwave Theory and Techniques, 2002, 50(3): 674-677.
  • 10Chindris Garbriel. Integrating sensor devices in a LIN bus network[C]. 26th International Spring Seminar on Electronic Technology, 2003:150-153.

共引文献41

同被引文献11

引证文献2

二级引证文献4

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部