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稀土铈在Sn-Zn无铅钎料表面的高温氧化行为 被引量:1

High-temperature oxidation behavior of cerium on the surface of Sn-Zn lead-free solders
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摘要 通过俄歇电子能谱法和X射线光电子能谱法研究了Sn-9Zn-0.15Ce和Sn-9Zn-0.002Al-0.2Ga-0.25Ag-0.15Ce两种钎料表面Ce元素的分布和存在形式.结果表明,铈在Sn-9Zn-0.15Ce钎料表面0~40 nm范围内的富集区浓度达到30%(原子分数)左右,是基体内部的250倍,主要以CeO2和Ce2O3形态存在.在Sn-9Zn-0.15Ce钎料中复合添加镓和铝后,Ga元素在钎料表面0~6 nm范围内富集,Al元素在表面2~20 nm范围内富集并主要以氧化态形式存在.Ce元素富集在距离钎料表面2~60 nm的范围内,处于Ga,Al元素富集层的下方;由Ga,Al元素富集层构成的致密保护膜可显著降低表面铈被氧化的概率. The distribution and existing form of Ce on the surface of Sn-9Zn-0.15Ce and Sn-9Zn-0.002Al-0.2Ga-0.25Ag-0.15Ce solder are investigated by atomic emission spectrometry and X-ray photoelectron spectroscopy.Results indicate that Ce enriches on the surface of the Sn-9Zn-0.15Ce solder in the range of 0 to 40 nm.The concentration of Ce in the enriched zone is about 30 at.%,which is 250 times of that in the bulk solder,and the enriched Ce on the surface is mostly oxidized as CeO2 and Ce2O3.With the multi-addition of Ga and Al in the Sn-9Zn-0.002Al-0.2Ga-0.25Ag-0.15Ce solder,Ga enriches in range of 0 to 6 nm on the surface,while Al enriches in range of 2 to 20 nm in oxidized form.The Ce-enriched layer is in the range of 2 to 60 nm on the surface covered by the Ga and Al enriched layers,and the oxidation of Ce is depressed significantly.
出处 《焊接学报》 EI CAS CSCD 北大核心 2010年第12期65-69,共5页 Transactions of The China Welding Institution
基金 宁波大学人才工程资助项目(201048) 宁波大学王宽诚幸福基金资助项目
关键词 SN-ZN 无铅钎料 氧化 表面富集 Sn-Zn lead-free solder Ce oxidation surface enrichment
作者简介 王慧,男,1982年出生,博士,主要从事钎焊技术及无铅钎料研究.发表论文20篇.Email:wanghui2@nbu.edu.cn
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参考文献10

  • 1Ogunseitan O A. Public health and environmental benefits of a- dopting lead-tree solders[ J]. Journal of the Minerals, Metals and Materials Society, 2007, 59 ( 7 ) : 12 - 17.
  • 2Suganuma K, Kim K S. Sn-Zn low temperature solders[ J ].Journal of Materials Seience: Materials in Electronics, 2007, 18 (1/3): 121-127.
  • 3Jiang J X, Lee J E, Kim K S. et al. Oxidation behavior of Sn-Zn solders under high-temperature and high-humidity conditions [ J ]. Journal of Alloys and Compounds, 2008,462 (1/2) : 244-251.
  • 4Wu C M L, Law C M T, Yu D Q, et al. The wettability and mi- crostructure of Sn-Zn-RE alloys[ J ]. Journal of Electronic Materi- als, 2003, 32 ( 2 ) : 63 - 69.
  • 5WuC M L, Yu DQ, Law C MT, et al. The properties of Sn- 9Zn lead-free solder alloys doped with trace rare earth elements [ J ]. Journal of Electronic Materials, 2002, 31 (9) : 921 - 927.
  • 6Li Z A, Mikula A, Qiao Z Y. Surface properties of the Sn-9Zn Alloy with the trace addition of lanthanum [ J ]. Monatshefte ftir Chemic/Chemical Monthly, 2005, 136( 11 ) : 1835 - 1840.
  • 7Chen Wenxue, Xue Songbai, Wang Hui. Effects of rare earth Ce on properties of Sn-9Zn lead-free solder[ J]. Journal of Materials Science : Materials in Electronics, 2010, 21 ( 7 ) : 719 - 725.
  • 8Wang Hui, Xue Songbai, Chen Wui. Effects of Ga,M, Ag, and Ce muhi-additions on the properties of Sn-9Zn lead-free solder [J]. Journal of Materials Science: Materials in Electronics. 2010, 21(2) : 111 -119.
  • 9黄惠忠.表露化学分析[M].上海:华东理工大学出版社,2007.
  • 10任晓雪,李明,毛大立.合金元素对Sn-Zn基无铅钎料高温抗氧化性的影响[J].电子元件与材料,2004,23(11):40-44. 被引量:39

二级参考文献9

  • 1[1]McCormack M, Jin S, Kammlott G W. The design of new, Pb-free solder alloys with improved properties [A]. In: Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment [C]. Orlando FL USA, 1995, 171-176.
  • 2[2]Hua F, Glazer J. Lead-free solders for electronic assembly[A]. Symposium on Design & Reliability of Solders and Solder Interconnections at the TMS Annual Meeting [C]. MIT Orlando Florida USA, 1997, 65-73.
  • 3[3]Vaynman S, Fine M E. Development of fluxes for lead-free solders containing zinc [J]. Scripta Materialia, 1999, 41(12): 1269-1271.
  • 4[4]Tadauchi M, Komatsu I, Tateishi H, et al. Sn-Zn Eutectic Alloy Soldering in a Low Oxygen Atmosphere [A]. In: Proceedings EcoDesign 2001 Second International Symposium on environmentally Conscious Design and Inverse Manufacturing [C]. Tokyo Japan, 2001, 1055 -1058.
  • 5[6]Lin K L, Liu T P. High-Temperature Oxidation of a Sn-Zn-Al Solder [J]. Oxidation Metals, 1998, 50(3/4): 255-267.
  • 6[7]Lin K L, Chen K I, Hsu H M, et al. Improvement in the Properties of Sn-Zn Eutectic Based Pb-free Solder [A]. 53rd Electronic Components and Technology Conference [C]. 2003, 658-663.
  • 7[9]Suganuma K. Advances in lead-free electronics soldering [J]. Current Opinion Solid State Mater Sci, 2001, 5: 55-64.
  • 8[10]Mulugeta Abtew, Guna Selvaduray. Lead-free solders in microelectronics [J]. Mater Sci Eng, 2000, 27: 95-141.
  • 9黄惠珍,魏秀琴,周浪.无铅焊料及其可靠性的研究进展[J].电子元件与材料,2003,22(4):39-42. 被引量:44

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