摘要
研究了对ＩｎＳｂ的激光划片过程，得出了刻槽深度和宽度随着脉冲重复频率、工作电流和刻划速度的变化规率。
Laser scribing of InSb wafer was studied and the relationship between process parameters (pulse frequency,electrical current and traverse speed)and groove depth and width has been obtained.
出处
《激光与红外》
CAS
CSCD
北大核心
1999年第2期88-91,共4页
Laser & Infrared
