摘要
采用ATmega16单片机和发射接收电路,实现了无损测厚,考虑到测量环境温度对超声波传播速度的影响,通过温度补偿的方法对传播速度予以校正.系统能实时地测量数据,具有硬件结构简单、工作可靠、测量误差小等特点.
Based on the analysis of the principle of ultrasonic thickness measurement, and by using MCU ATmegall6 and transmitter-receiving circuit, non-destructive thickness measurement is achieved by ultrasonic transducer, but considering the ambient temperature which has a strong impact on the ultrasonic propagation velocity, temperature compensating method is used to calibrate. The system can be measurement data in real time, and the features are simple hardware structure, reliable and error minimum.
出处
《常熟理工学院学报》
2010年第4期95-97,共3页
Journal of Changshu Institute of Technology
关键词
超声波
测厚
单片机
温度补偿
ultrasonic
thickness measurement
MCU
temperature compensation
作者简介
郑宝瑞（1965-），男，黑龙江齐齐哈尔市人，工程师，研究方向：计算机控制，自动检测，数控机床设计等．
陆仲达（1970-），男，黑龙江省哈尔滨市人，齐齐哈尔大学计算机与控制工程学院教授，硕士，研究方向：计算机控制、网络控制等．
