4Jiromaru Tsujino, Himyuki Yoshihara, Kazuyoshi, et al. Welding characteristics and temperature rise of high frequency and complex vibration ultrasonic wire bonding[J]. Ultrasonic, 1998, (36) : 59-65.
5E D Nicholas. Friction welding of copper to aluminum [J]. Metal Construction, March, 1975: 12-17.
6George G Harman, John Albers. Ultrasonic welding mechanism as applied to aluminum-and gold-wire bolding in microelectronics [J]. IEEE Transactions on Parts, Hybrids and Packaging, 1977, 13 (4): 406-412.
7Jiromaru Tsujino, characteristics of vibration systems SYMPOSIUM [C] Koichi Hasegawa, Yukio Sone, et al. Frequency ultrasonic wire bonding using high frequency of 40 kHz to 780 kHz [A]. ULTRASONICS 1996:1 021-1 026.
8Jiromaru Tsujino, Hiroyuki Yoshihara, Kazuyoshi, et al. Welding characteristics and temperature rise of high frequency and complex vibration ultrasonic wire bonding [A ]. Ctrasonics [ C ]. 1998.59-65.
9Jiromaru TSUJINO, Tetsugi UEOKA. Welding characteristics of various metal plates ultrasonic seam and spot welding systems using a complex vibration welding tip [A]. Ultrasonics Symposium[C ]. 2001: 669-674.
10Jiromaru TSUJINO, Tetsugi UEOKA, Ichiro WATANABE, et al. New methods of ultrasonic metal welding[A]. Uctrasonics Symposium [C]. 1995: 405-410.
6Jiromaru Tsujino, Tetsugi Ueoka. Studies on ultrasonic Welding [ C ]// Proceeding of The China-Japan Joint Conference on Ultrasonics. Nanjing, China, 1987: 471-474.
7O' Brien R L. Welding handbook (The Eighth Edition), Volume 2: Welding Processes [ M ]. American Welding Society, Miami, 1991, 783-812.
8Ji H J, Li M Y, Wang C Q, et al. Comparison of interface evolution of ultrasonic aluminum and gold wire wedge bonds during thermal aging[J]. Materials Science and Engineeering A, 2007, 447( 1 ) : 111 - 118.
9Li J H, W F L, L H, et al. Theoretical and experimental analyses of atom diffusion characteristics on wire bonding interfaces [J ]. Journal of Physics D : Applied Physics, 2008, 41 ( 13 ) : 5 303-5 306.
10Ding Y, Kim J K and Tong P. Numerical analysis of ultrasonic wire bonding: Effects of bonding parameters on contact pressure and frictional energy[J]. Mechanics of Materials, 2006, 38( 1 ) : 11-24.
