摘要
研究了加工条件对PC/PAR合金的模量、透光性能、相容性以及热性能的影响。DMA、SEM、TGA以及透光性能。研究结果表明,加入DSDP,可有效提高酯交换共混物模量、相容性和热稳定性,加入0.4%DSDP在270℃密炼8min,性能最佳,350℃时的失重率仅为2.81%,透光率可达83.3%,可作为透明的耐高温材料使用。
A novel transparent PC/PAR blends with high heat resistance was prepared, and the modulus, transparency,compatibility and thermal stability were investigated. The DMA and SEM investigations showed that DSDP can readily improve the modulus and compatibility of polymer blends with a fraction of 0. 4% and melt blend time of 8min at 270℃. The transparency results suggested that the transparence of PC/PAR （70 ： 30） blends was 83.3% under the same condition. The TGA comparisons showed that the weight loss was only 2. 81% at 350℃. Our study paves the way for the development and applications of high performance PC blends with high transparency and excellent heat resistance.
出处
《功能材料》
EI
CAS
CSCD
北大核心
2008年第9期1497-1499,1503,共4页
Journal of Functional Materials
基金
国家自然科学基金资助项目(50572081)
关键词
聚碳酸酯
聚芳酯
聚合物合金
透明性
耐热性
polycarbonate
polyarylate
polymer blends
transparency
heat resistance
作者简介
雷佑安（1979-），男，博士研究生，主要从事聚合物合金和功能化碳纳米管及其复合材料研究。
通讯作者：熊传溪
