摘要
研究了Ni的含量对无铅钎料Sn-3.0Ag-0.5Cu润湿性、熔点、重熔及老化条件下界面化合物(IMC)的影响。结果表明:微量Ni的加入使SnAgCu润湿力增加6%;使合金熔点略升高约3℃;重熔时在界面形成了(Cu,Ni)6Sn5IMC层,且IMC厚度远高于SnAgCu/Cu的Cu6Sn5IMC厚度。在150℃老化过程中,SnAgCuNi/Cu重熔焊点IMC随着时间的增加,其增幅小于SnAgCu/Cu的增幅,此时Ni对IMC的增长有一定抑制作用。
Effects of micro amount Ni on the wettability and melting point, intermetallic compounds （IMC） under thermal aging and reflow of the SnAgCu lead-free solder were investigated. The results show that the wetting force and the alloy melting point increase 6% and about 3 ℃, respectively with the addition of micro amount of Ni; the layer of （Cu, Ni）6Sn5 IMC is formed with a much larger thickness than that of Cu6Sn5 IMC in the SnAgCu/Cu on the interface. The thickness of IMC layers in the SnAgCuNi/Cu reflow solder joints grow less in the process of thermal aging at 150℃ than that of SnAgCu/Cu solder joints, Ni confines IMC grow in this condition.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2008年第9期65-68,共4页
Electronic Components And Materials
基金
国家自然科学基金资助项目(No.50575060)
哈尔滨市科技创新人才研究专项资金资助项目(No.RC2006QN006012)
关键词
电子技术
镍
无铅钎料
焊点界面
electron technology
Ni
lead-free solder
interface of solder joint
作者简介
王丽凤（1964-），女，黑龙江巴彦人，教授，主要从事先进材料及微连接技术方面的研究。Tel：（0451）81586290；E—mail：wlf8151@126.com。通讯作者：王丽凤
