摘要
鉴于目前对微波裸芯片的旺盛需求,介绍了几种测试技术,主要包括探针台测试技术、夹具测试技术和非侵入式测试技术,并对不同的测试技术进行了对比,分析了各种测试方法的优缺点及存在的问题。
The article mainly focuses on the testing technology for microwave bare dies, which are widely used currently. Three testing technologies are discussed in this paper, including probe test technology, carrier test technology and non-contacted test technology. At last, the advantages and disadvantages of various test methods are presented.
出处
《电子产品可靠性与环境试验》
2008年第4期55-58,共4页
Electronic Product Reliability and Environmental Testing
作者简介
吴少芳（1983-），女，广东潮州人，广东工业大学微电子学与固体电子学专业在读硕士研究生，研究方向为微波裸芯片的测试与老化筛选技术。
