期刊文献+

化学镀低磷镍-磷合金工艺的研究 被引量:3

Electroless Low-phosphorous Nickel-Phosphorous Alloy Plating Technics
在线阅读 下载PDF
导出
摘要 使用丙酸-乳酸体系化学镀低磷Ni-P合金,研究了镀液中镍与磷的浓度比、乳酸、丙酸、pH对镀速和磷含量的影响,并得到了最佳低磷化学镀Ni-P合金工艺。实验结果表明,提高硫酸镍与次磷酸钠的质量浓度比和pH,降低乳酸和丙酸的质量浓度,有利于得到低磷化学镀Ni-P合金层。 The lactic-propionic mixture was employed for the investigation of the low-phosphorous Ni-P alloy electroless plating technics. The effects of various factors, such as concentration ratio of NiSO4·6H2O with NaH2PO2·H2O, lactic acid, propionic acid and pH value, on the deposition rate and phosphorus content of the coatings, were investigated. Accordingly, the optimum parameters for low-phosphorous Ni-P alloy electroless plating were obtained. The research indicates that the low-phosphorous coating can be obtained when increasing concentration ratio of NiSO4·6H2O with NaH2PO2·H2O and pH value and decreasing the concentrations of lactic acid and propionic acid.
出处 《电镀与精饰》 CAS 2008年第4期1-3,共3页 Plating & Finishing
关键词 低磷 化学镀 磷含量 Ni—P合金 low- phosphorous electroless plating phosphorus content Ni- P alloy
作者简介 刘琼(1981-),女,山东忻州人,哈尔滨工业大学应用化学系硕士研究生.
  • 相关文献

参考文献6

  • 1袁承超,陈益芳,陈云飞,林晓辉.金属微细结构化学镀镍及镀液稳定性分析[J].纳米技术与精密工程,2005,3(3):189-193. 被引量:2
  • 2郑丹兴,冯流,武向红.环境保护与绿色技术[M].北京:化学工业出版社,2002.38-40
  • 3Hongwei H, Ying L, Fuhui W. Corrosion of AZ91D magnesium alloy with a chemical conversion coating and electroless nickel layer [ J ]. Corrosion Science, 2004, 46 (6) : 1467-1477.
  • 4Wang C J, Li C C. Corrosion behaviors of AISI1025 steels with electroless NickeL/Aluminized coating in NaCl-induced hot corrosion [ J ]. Surface and Coatings Technology, 2004, 177-178 ( 1 ) : 37-43.
  • 5Guofeng Cui, Ning Li, Deyu Li. Study of optimized complexing agent for low-phosphorous electroless nickel plating bath [ J ]. Journal of The Electrochemical Society, 2005, 152(10) :1-6.
  • 6刘海萍,李宁,毕四富.用正交试验法优选化学镀镍四元复合添加剂[J].材料保护,2006,39(10):30-32. 被引量:2

二级参考文献17

  • 1[1]Hanna Farid, Hamid Z Abdel, Aal A Abdel. Controlling factors affecting the stability and rate of electroless copper plating[ J]. Materials Letters ,2003,58:104-109.
  • 2[2]Malecki A, Micek-Ilnicka A. Electroless nickel plating from acid bath[J]. Surface and Coatings Technology,2000,123:72-77.
  • 3[5]Yin X, Hong L, Chen B H, et al. Modeling the stability of electroless plating bath-diffusion of nickel colloidal particles from the plating frontier[ J ]. Journal of Colloid and Interface Science, 2003,262: 89-96.
  • 4[6]Hirsch T J, Miracky R F, Lin C. Selective-area electroless copper plating on polyimide employing laser patterning of a catalytic film[J].Appl Phys Lett,1990, 57:1 357-1 359.
  • 5[7]Dubin V M, Shacham-Diamand Y, Zhao B, et al. Selective and blanket electroless copper deposition for ultralarge scale integration[ J ]. J Electrochem Soc , 1997,144: 898-908.
  • 6[8]Tsai Tingkan, Chao Chuenguang. The growth morphology and crystallinity of electroless NiP deposition on silicon [ J ].Applied Surface Science,2004,233:180-190.
  • 7[9]Cheong W J, Luan Ben L, Shoesmith David W. The effects of stabilizers on the bath stability of electroless Ni deposition and the deposit [ J ]. Applied Surface Science, 2004, 229:282-300.
  • 8[10]Souleimanova Razima S, Mukasyan Alexander S, Varma Arvind. Study of structure formation during electroless plating of thin metal-composite membranes [ J ]. Chemical Engineering Science, 1999,54:3 369-3 377.
  • 9Bulwith R A, Troshy M, Piccione I M. The 'Black Pad' Failure Mechanism From Beginning to End[ J ]. Global SMT & Packaging Journal, 2002 (9) : 1.
  • 10Walsh M, Newark. Electroless Nickel Immersion Gold and Black Pad[ J]. Galvanotechnik, 2002(9) :2281.

共引文献3

同被引文献23

引证文献3

二级引证文献6

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部