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Thermal residual stress analysis of diamond coating on graded cemented carbides

Thermal residual stress analysis of diamond coating on graded cemented carbides
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摘要 Finite element model was developed to analyze thermal residual stress distribution of diamond coating on graded and homogeneous substrates. Graded cemented carbides were formed by carburizing pretreatment to reduce the cobalt content in the surface layer and improve adhesion of diamond coating. The numerical calculation results show that the surface compressive stress of diamond coating is 950 MPa for graded substrate and l 250 MPa for homogenous substrate, the thermal residual stress decreases by around 24% due to diamond coating. Carburizing pretreatment is good for diamond nucleation rate, and can increase the interface strength between diamond coating and substrate. Finite element model was developed to analyze thermal residual stress distribution of diamond coating on graded and homogeneous substrates.Graded cemented carbides were formed by carburizing pretreatment to reduce the cobalt content in the surface layer and improve adhesion of diamond coating.The numerical calculation results show that the surface compressive stress of diamond coating is 950 MPa for graded substrate and 1 250 MPa for homogenous substrate,the thermal residual stress decreases by around 24% due to diamond coating.Carburizing pretreatment is good for diamond nucleation rate,and can increase the interface strength between diamond coating and substrate.
作者 黄自谦 贺跃辉 蔡海涛 武从海 肖逸锋 黄伯云
机构地区 State Key Laboratory of Powder Metallurgy School of Mathematical Science and Computing Technology College of Science
出处 《Journal of Central South University of Technology》 EI 2008年第2期165-169,共5页 中南工业大学学报（英文版）
基金 Project(50323008) supported by the National Natural Science Foundation of China
关键词 graded cemented carbides diamond coating finite element method CARBURIZING 分类碳合物 金刚石涂敷 有限元方法 热处理
分类号 TB115 [理学—应用数学]
作者简介 Corresponding author： HE Yue-hui, Professor; Tel： ＋86-731-8877391; E-mail： yuehui@mail.csu.edu.cn
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参考文献13

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二级参考文献11

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Journal of Central South University of Technology
2008年 第2期

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