摘要
在NaBH4/EDA体系中还原CuCl2,石墨层间化合物合成了石墨包覆纳米铜复合填料(GECNP)。以GECNP为导电填料,采用球磨共混-热压成型工艺制备了超高分子量聚乙烯(UHMWPE)基复合材料。UHMWPE/GECNP复合材料的X射线衍射(XRD)分析表明:在制备过程中无新相生成;扫描电镜(SEM)观察发现:其微观结构均匀,GECNP以纳米片状分散于基体中,构成导电网络;有关导电性的研究表明:复合材料导电机制符合聚合物基复合材料的导电渗滤理论,渗滤阈值为8.766%,低于常规碳系填料。当GECNP体积浓度为12.8%时,体系电导率最高,为7.55S/cm,高于石墨纳米片填料。
Graphene encapsulated copper nanoparticles （GECNP） were synthesized by reducing the precursor of CuCl2 graphite intercalation compounds in ethylenediamine （EDA） solution of NaBH4. The composite of ultra-high molecular weight polyethylene （UHMWPE） were formed by using GECNP as filler through ball milling-mixture and hot-press molding technology. X-ray diffraction examination revealed that not any new phase was formed in the preparation process of UHMWPE/GECNP matrix. SEM observation found that the microstructure of composite was homogeneous;The nanosheets of GECNP were dispersed in the matrix of UHMWPE and formed a conductive net. The measurement results of conductance showed the conduction mechanism of UHMWPE/GECNP was according to the percolation theory of polymer matrix, the percolation threshold was 8. 766% ,and it was far smaller than that of common carbon fillers. The maximum conductivity was equal to 7.55S/cm and was higher than that of the graphite nanosheets filler.
出处
《塑料》
CAS
CSCD
北大核心
2008年第1期43-46,24,共5页
Plastics
基金
湖北省自然科学基金项目资助(2004ABA090)
作者简介
薛俊（1976-），女，硕士，讲师，主要从事功能纳米复合材料研究。
联系人：曹宏。
