期刊文献+

微水导激光划片工艺原理及应用 被引量:5

The Technology Principle and Application of Water-Jet-Guided Laser Scribing
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摘要 从应用需求出发,介绍了微水导激光划片工艺的主要原理和特点;对其关键工艺机构中的光学聚焦系统、激光在水柱中的全反射传播、激光系统、压力水腔和喷嘴组成的光液耦合器等原理进行了简单分析和介绍;对微水导激光划片工艺的应用前景进行了总结和展望。 The principal principle and special features of the water-jet-guided laser scribing technology is introduced by application in demand in this paper, and the primary principle of optical focusing system, the reflecting transmitting of laser light through water beam, the laser system, the photo-liquid coupling mechanism buildup by pressure water chamber and nozzle etc are analyzed simply and introduced. In the end, the application prospects of water-jet-guided laser scribing technology is summarized and presented.
作者 王宏智
出处 《电子工业专用设备》 2008年第3期27-31,49,共6页 Equipment for Electronic Products Manufacturing
关键词 微水导激光 光液耦合 划切 微水柱 热熔效应 超薄晶圆 Low—K介质层 LED衬底 Water-Jet-Guided Laser Photo-Liquid Coupling Scribing Water Beam-Riding Heading Fuse Effect Ultra-Thin Wafer Low-k Dielectric Layer LED Substrate
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同被引文献40

  • 1周永恒,廖健宏,蒙红云,刘颂豪.血管内支架的激光精细切割技术[J].应用激光,2005,25(3):161-164. 被引量:8
  • 2宋林森,史国权,李占国.激光打孔温度场的数值分析与仿真[J].工具技术,2006,40(8):12-15. 被引量:7
  • 3龙芋宏,熊良才,史铁林.水辅助准分子激光微加工硅的实验研究[J].激光技术,2006,30(6):567-569. 被引量:11
  • 4刘爱梅.球透镜的折射率计算与成像分析[J].孝感学院学报,2007,27(3):35-37. 被引量:1
  • 5Bernold Rieherzhagen. Industrial applications of the water-jet guided laser[J]. Lasers in Manufacturing, 2002 (28) :28--30.
  • 6Philippe Couty, Frank Wagner. Laser coupling with a multimode water-jet wave guide[J]. Optical Engineering, 2005,44(6):068001.1-8.
  • 7Porter J A,Louisalmi Y A,Karjalainen J A,et al. Cutting thin sheet metal with a water jet guided laser using various cutting distances, feed speeds and angles of incidence [J]. International Journal of Advanced Manufacturing Technology, 2007,33 (9/10) : 961 - 967.
  • 8Li Ling, Wang Yang, Yang Lijun, et al. Experimental researeh on water-jet guided laser processing[J]. Proceedings of SPIE,2007,6595: 659525.1-6.
  • 9Wang Yang, Li Ling, Yang Lijun, et al. Simulation and experimental research on water-let guided laser cutting silicon wafer [ C ]//International Conference on Electronic Packaging Technology & High Density Packaging (ICEPTHDP 2008). Shanghai, China.. IEEE, 2008 :1- 6.
  • 10Frank Wagner,Ochelio Sibailly,Nandor Vagoet al. The laser microjet technology-10 years of development (M401) [C]//International Congress on Applications of Laser & Electro-Optics ( ICALEO 2003 ). Jacksonville USA.. Laser Institute of America(LIA) Pub,2003,595 : 1 -9.

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