摘要
以3,3’,4,4’-二苯甲酮四酸二酐(BTDA)和4,4’-二氨基二苯醚(ODA)为原料,采用化学环化法合成了酮酐型热塑性聚酰亚胺(TPI)。通过DSC测得TPI的玻璃化转变温度为275℃。TGA结果显示TPI的5%质量损失温度为560℃,具有很好的热稳定性;将TPI用于LP-15的增韧发现,在所研究的TPI用量范围内,TPI与LP-15具有很好的相容性,两者间形成了均匀的半互穿网络结构。当TPI的用量为20%(质量分数)时,树脂的Tg比纯LP-15的高13.5℃,简支梁冲击强度提高256%,即同时改善了树脂的韧性和耐热性,取得了传统增韧方法难以实现的效果。
A kind of thermoplastic polyimide （TPI） was synthesized with 3,3＇, 4,4＇-benzophenonetetracarboxylic dianhydride （BTDA） and 4, 4 ＇-oxydianiline （ODA） as monomers, the imidization process was a chemical one . The glass transition temperature of TPI was 275℃. TGA temperature at 5% mass loss was 560℃,this indicated that the TPI had good thermooxidative stability. Within the interested content range, TPI had good compatibility with LP-15, a semi-interpenetrating network （IPN） was formed between them. When the TPI content was 20% （mass fraction） ,the Tg value and impact strength were 13. 5℃ and 256% higher than those of LP-15 respectively,i, e. The modified resin exhibited simultaneous improvement in both toughness and Tg, which were very difficult to achieve by conventional toughing methods.
出处
《材料工程》
EI
CAS
CSCD
北大核心
2008年第1期45-48,53,共5页
Journal of Materials Engineering
基金
先进复合材料国防科技重点实验室基金资助项目(51460010105BQ0101)
作者简介
王文俊（1967-），女，副教授，从事复合材料树脂基体的改性研究，联系地址：北京理工大学材料学院（100081）。E-mail：wangwenjun318@sina．com
