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用真空温压技术制备纳米金属铜块体材料 被引量:2

Preparation of nanocrystalline metallic copper with vacuum warm-pressing technique
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摘要 采用自悬浮-真空温压法制备纳米金属Cu块体材料。通过X射线衍射(XRD)、扫描电镜(SEM)、透射电镜(TEM)、正电子湮没(PAS)实验、HMV-2型显微硬度计和用Arechimedes原理等测试手段研究压制压力、保压时间、温度等工艺参数对样品密度的影响;考察其热稳定性和微结构。研究结果表明:纳米金属Cu块体材料的密度随压制压力、保压时间和温度的增加而提高,最高相对密度为96.15%;纳米金属Cu块体材料具有较好的热稳定性;在1.5 GPa和200℃压制的样品的平均晶粒度为25.3 nm,微应变为0.047%。 Nanocrystalline Cu bulk material was prepared with flow-levitation vacuum warm-pressing technique. The influences of compacting pressure, pressure-holding time and temperature on density, heat stability and microstructure of samples of as-compacted nanocrystalline Cu were investigated by means of X-ray diffractometer(XRD), scanning electron microscopy(SEM), transmission electron microscopy(TEM), positron annihilation spectroscopy (PAS), Vickers microhardness tester(HMV-2) and density measurements on the principle of Arechimedes. The experimental results show that the density of nanocrystalline Cu increases with the increase of compacting pressure, pressure-holding time and temperature, and a specimen of as-synthesized bulk nanocrystalline Cu with the highest relative density of 96.15% is obtained of all samples. At the same time, the nanocrystalline Cu shows higher heat stability. The sample of nanocrystalline Cu with average grain size of 25.3 nm and mean microstrain of 0.047% is produced with vacuum warm-pressing technique under 1.5 GPa and at 200 ℃ for 1 h.
出处 《中南大学学报(自然科学版)》 EI CAS CSCD 北大核心 2007年第5期873-879,共7页 Journal of Central South University:Science and Technology
基金 国家自然科学基金资助项目(10475069/A0506)
关键词 真空温压技术 纳米金属铜 密度 显微硬度 惯性约束核聚变靶材料 vacuum warm-pressing technique nanocrystalline Cu density microhardness inertial confinement fusion target materials
作者简介 楚广(1958-),男,湖南长沙人,高级工程师,博士,从事金属纳米材料研究;通信作者:楚广,男,高级工程师,博士;电话:0731—8836791;E—mail:user12134@sina.com
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