摘要
基于热叠加模型,选取表面组装电子元件的平均温度作为评价指标,确定出用于热布局优化的适应度函数,基于遗传算法提出了一种电子元件热布局优化算法,并编制相应优化程序,实现了对电子元件的热布局优化;利用有限元软件ANSYS结合具体实例对优化结果进行仿真验证,验证结果表明优化结果与仿真结果基本一致,由此验证了热布局优化程序的有效性;根据优化结果得出热布局规则:各大功率电子元件分散开,并分布于板级电路四周,各小功率电子元件围绕大功率电子元件分布于中心,并按一定规律排列。
The average temperature of electronic component is chosen as the evaluation index in thermal superposition model, the fitness function is established for thermal placement optimization. Based on genetic algorithms, a placement optimization algorithm of thermal model is proposed and placement optimization of thermal model is achieved by corresponding optimization program. An example was analyzed using ANSYS, the finite element simulation software, to validate the final optimization results. As a result, the optimization results conform to the simulation results, thus the validity of thermal placement optimization program was proved. Some placement rules obtained from the optimization are as follows： each big power component should be separated and be placed around board eleetroeireuit ; each small power component should be placed in the center around big power one by certain rules.
出处
《电子机械工程》
2007年第2期12-17,共6页
Electro-Mechanical Engineering
关键词
遗传算法
布局优化
有限元
热分析
genetic algorithms
placement optimization
finite element
thermal analysis
作者简介
阎德劲（1982-）,男,重庆石柱人,硕士,研究方向为表面组装技术和人工智能技术.
