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Cu对铝基化学镀Ni-Cu-P镀层耐蚀性能的影响 被引量:11

The influence of Cu on the corrosion resistance of electroless Ni-Cu-P deposits on Al substrate
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摘要 采用直接镀工艺,在铝基体上获得了化学镀N-P、Ni-Cu-P各种结构镀层。用X射线衍射分析了镀层结构;用SEM观察了各种结构镀层的表面形貌;测定了各种结构镀层的镀速和结合力;利用线性极化和阳极极化曲线分析了各种结构镀层的耐蚀性能。结果表明,利用直接化学镀工艺可以在铝基上获得结合力良好的镀层;通过控制络合剂的用量可以得到不同结构和不同铜含量的Ni-Cu-P镀层;当镀层达到一定厚度后,Cu元素可以显著提高镀层的耐蚀性能。 By adopting direct plating method, electroless Ni-P and Ni-Cu-P deposits with different structures are obtained on Al substrate. XRD and SEM were used to study the structure and surface morphology of the deposits. The plating rate and cohesion of different structure coatings were measured. The corrosion resistance of the coatings was analyzed by linear and anodic polarization. The results show that electroless Ni-P and Ni-Cu-P coatings with excellent cohesion are obtainable on Al substrate by direct plating method and coatings of different structure and different Cu content can be obtained by controlling the quantity of complex agent. Cu element improves significantly the corrosion resistance of the coatings with the condition that their thickness reaches a certain range.
出处 《功能材料》 EI CAS CSCD 北大核心 2007年第4期683-687,共5页 Journal of Functional Materials
基金 广东省攻关资助项目(2004B10301013)
关键词 铝基 化学镀 结合力 铜元素 腐蚀性能 Al substrate electroless plating cohesion Cu element corrosion resistance
作者简介 黄亮(1980-),男,江西吉安人,在读硕士,师承高岩教授,从事化学镀表面改性和腐蚀防护研究。 通讯作者:高岩
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参考文献13

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