摘要
陶瓷/金属润湿性研究对于陶瓷-金属连接以及金属陶瓷复合材料的制造有重要意义。采用座滴法研究了SiC/Ag+Ti体系的润湿性。测定了不同成分的焊料与SiC基体的接触角。试验结果表明Ti的添加能显著改善体系的润湿性。随Ti含量的增加,接触角不断减小;温度升高、保温时间延长,接触角也减小。微观分析显示,界面处形成一反应层,润湿界面存在明显的元素互扩散现象。
The research of wettability between ceramics and liquid metals is important for joining of ceramics to metals and manufacturing of cermet.Wettability of reaction bonded SiC/Ag plus Ti system is studied. The contact angle is determined by high temperature photography. The wettability of the system is remarkably improved by adding active element titanium into the metallic phase. The contact angle decreases with the increasing of Ti content.The holding time at the temperature of wetting test strongly affects the contact angle which decreases with the extension of holding time at 980 ℃ up to 15 minutes. Micro-analysis reveals that inter-diffusion takes place and a reaction layer forms at the interface.
出处
《新技术新工艺》
2006年第11期81-83,共3页
New Technology & New Process
关键词
SIC
润湿性
接触角
界面
SiC, wettability, contact angle, interface
作者简介
张建军（1973-），女，河北唐山人，博士，副教授。主要从事材料分析、陶瓷连接、陶瓷基复合材料制备方面的研究。
