期刊文献+

胶接接头界面理论及其表面处理技术研究进展 被引量:32

A Review of Research on the Interface of Bonded Joints and Its Theories
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摘要 胶接是用胶粘剂将被粘物表面连接在一起,形成可承受外载的胶接接头的过程,是涉及材料粘附、高分子材料老化机理、表面技术、力学性能测试等多个学科领域的边缘学科。介绍了与胶接接头界面紧密相关的弱界面层理论和润湿理论等领域的研究进展,总结了胶接接头表面处理方面的主要方法。 Bonding is a technological procedure that joins the surfaces of the adherends to form a adhesively bonded joint subjected to external load. It is an interdisciplinary subject dealing with material adhesion, ageing mechanism of the polymer,interface science and technology,mechanical properties evaluation and so on. The recent developments in research concerning the interface of bonded joints (i. e. two interracial theories: weak interracial film theory and wetting theory) are introduced. And finally some methods of surface treatment to improve bonded joints' load bearing ability are also discussed.
出处 《材料导报》 EI CAS CSCD 北大核心 2006年第10期48-51,共4页 Materials Reports
基金 湖北省教育厅科研计划重大项目(项目编号:2003Z001)
关键词 胶接接头 界面 弱界面层理论 润湿理论 adhesively bonded joint,interface, weak interracial film theory, wetting theory
作者简介 李智:男,1982年生,硕士研究生,研究方向为胶接技术,E-mail:yish@ctgu.edu.cn 游敏:通讯联系人,男,1958年生,教授,博士,Tel:0717-6392004,E-mail:youmin@ctgu.edu.cn
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参考文献21

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