摘要
对陶瓷材料小裂纹的生长与聚合规律进行了试验研究。结果表明由Ｖｉｋｅｒｓ压痕法引入的单个小裂纹的裂纹扩展速率（ｄａ／ｄｔ）随裂尖应力强度因子的增大呈先降后升的Ｖ形特征。理论分析和数据处理均表明这种特征是由压痕法引入的残余应力场的影响所致。试验结果还表明多个小裂纹的生长与聚合规律也与残余应力场密切相关。
The small crack growth of a single crack and coalescence of multi-cracks in ceramics are experimently investigated in this paper. The Vikers indentation crack velocity da/dt,firstly decreases and then increases with the stress intensity factor K I,indicating a V-shape behavior ,whether it is single or coalescence. The effect of residual stress due to the indentation should be taken into account for single crack in the test. Further study shows that the growth and coalescence behaviors of multi-cracks are closely related to the reduplicate residual stress field(RRSF)at crack tip which depend on the parameterδ.The RRSF model and the corresponding expressions which are firstly introduced by the authors appropriately explain the test results.
出处
《宇航学报》
EI
CSCD
北大核心
1996年第1期41-45,共5页
Journal of Astronautics
基金
原航空航天工业部青年科学基金资助
关键词
陶瓷材料
裂纹
残余应力场
生长
聚合
Ceramic Small crack Residual stress Vikers indentation Stress intensity factor
