摘要
对酸性氯化物型化学镀锡的增厚工艺进行了研究。讨论了镀液中Sn2+浓度、NaH2PO2浓度、(NH2)2CS含量及络合剂B等组分对化学镀沉积速度的影响,并提出了最佳的工艺条件;同时,利用扫描电镜(SEM)和电子能谱(EDS)对镀层表面形貌和镀层成分进行了分析。结果表明:在一定工艺条件下可获得厚度为7.5μm左右的银白色无光化学镀锡层,镀层表面晶粒大小均匀细致,镀层含锡量为95.6%质量分数。
The increassate technology of electroless tin plating in chloride system was studied in this paper. The effect of components concentration on deposition rate were studied, such as Sn^2＋, NaH2PO2, （NH2）2CS, complex B, and the optimized technology were presented. Besides, the SEM and EDS analyses of surface morphology and deposition layer＇s composition were also made. The results showed that the tin deposition coating was silvery white, about 7.5 μm thick ,having fine and compact grains, and containing 95.6 % of w（Sn）.
出处
《中国表面工程》
EI
CAS
CSCD
2005年第6期41-44,共4页
China Surface Engineering
关键词
化学镀
镀锡
沉积速度
electroless plating
tin plating
deposition rate
作者简介
田文增（1981-）,男（汉）,江南邓州人,硕士生.地址：湖南省长沙市中南大学冶金学院 410083 Tel：13873151904 E-mail：wz-tian@yahoo.com.cn
