摘要
本文比较详细地探讨了现今应用很广的几种扩散硅压力传感器的结构及封装工艺,提出了全固态隔离膜片结构的基本封装形式,并对传感器结构设计和封装时必须注意的问题和基本参数进行了探讨。
An ail-solid isolation diaphragm structure of silicon pressure sensor packaging based on analysis of the structures and packaging techniques of pressure sensors widely used nowadays is proposed in this paper. Key issues and parameters of sensor structure design and packaging process arealso discussed.
出处
《仪表技术与传感器》
CSCD
北大核心
1996年第10期18-19,共2页
Instrument Technique and Sensor
关键词
扩散硅
压力传感器
传感器
Silicon, Pressure Sensor, Structure, Packaging.
