摘要
采用扫描电镜与能谱分析方法,研究了表面贴装技术的工艺参数(包括恒温区保温时间、传送带速度、锡膏粘度和锡膏模板厚度等)对共晶SnPb焊料与铜焊接界面的影响。结果显示,表面贴装技术工艺参数并不明显影响焊接界面金属间化合物(IMCs)层的组成(IMCs层的主要成分为Cu6Sn5相),但影响IMCs层的形貌,其中传送带速度会影响Cu6Sn5相的平均直径,而锡膏模板厚度与恒温区保温时间则对IMCs层的形态与厚度影响较大。
Effect of surface mount technology process parameter, including conveyer speed, isothermal time, solder paste viscosity, thickness of solder paste form board on the soldering interface between eutectic SnPh solder and Cu substrate was investigated with scanning electron microscope and energy dispersive X-ray spectroscopy）. It was found that surface mount technology process parameter did not affect the composition of Cu6Sn5 phase in intermetallic compounds （IMCs） layer between the eutectic SnPb solder and Cu suhstrate. However, the SMT process parameter, especially the isothermal time and the thickness of solder paste form board, changed the shape and thickness of IMCs layer.
出处
《理化检验（物理分册）》
CAS
2005年第10期497-500,共4页
Physical Testing and Chemical Analysis(Part A:Physical Testing)
关键词
工艺参数
焊接界面
金属间化合物层
Process parameter
Welding interface
Intermetallic Compounds layer
作者简介
肖代红（1971-）,男,博士.
