摘要
采用润湿平衡法测试了Sn-Ag-Cu无铅钎料在两种试验温度下和三种基体上的润湿时间和润湿力,研究了钎焊温度对Sn-Ag-Cu无铅钎料在不同基体上润湿性能的影响.研究结果表明,温度升高显著提高无铅钎料对基体的润湿能力,在260℃时,Sn-Ag-Cu无铅钎料的润湿时间已接近Sn-Pb的润湿时间,润湿力大于Sn-Pb钎料的润湿力;Sn-Ag-Cu钎料在Ni/Au、SnBi镀层上的润湿时间明显小于在无镀层基体上的润湿时间,且Sn-Ag-Cu钎料在三种基体上的润湿时间分别较在235℃时下降了34%～67%.
By means of wetting balance method, the wetting time, wetting force and the effects of soldering temperature on wettability of Sn-Ag-Cu lead-free solder were tested under the conditions of two temperatures and three substrates. The results indicate that the higher temperature remarkably improves wettability of lead-free solder on substrate. The wetting time of Sn-Ag-Cu lead-free solder on Cu substrate is close to that of Sn-Pb solder, and the wetting force is greater than that of Sn-Pb solder at 260°C. The wetting time of Sn-Ag-Cu lead-free solder on Ni/Au and SnBi coatings are obviously shorter than that on Cu substrate, and the wetting time of Sn-Ag-Cu solder on three substrates are decreased by 34%-67% compared with that of Sn-Ag-Cu at 235°C.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2005年第10期93-96,共4页
Transactions of The China Welding Institution
关键词
无铅钎料
润湿性
镀层
Brazing
Coatings
Temperature
Wetting
作者简介
王旭艳，女，1981年12月出生，硕士研究生。主要研究方向为微电子焊接技术及无铅钎料研究。发表论文2篇。Email：wxy6677_81@sina．com
