摘要
研究了陶瓷球栅阵列(CBGA)器件在-55～125 ℃温度循环条件下的热疲劳寿命,采用光学显微镜研究了失效试件焊点的失效机制,分析了裂纹萌生和扩展的方式.结果表明,失效试件裂纹最先萌生于四周最外侧焊球上下界面外边缘处,随着循环次数的增加,裂纹沿该界面从焊球边缘向中心扩展,裂纹的萌生和扩展是该处应力应变集中、热循环和蠕变相互作用的结果.
Thermal fatigue life of ceramic ball grid array (CBGA) devices under thermal cycling conditions was presented in -55°C∼125°C. Failure mechanism of the soldered joints including the germinating position and expanding direction of the cracks were observed and analyzed by optical microscopy. Results show that the crack in soldered joints germinates in the borderline all around the outmost solder balls. With the increasing of thermal cycling times, the cracks expand from the borderline of outmost solder balls to the ball center along the interfaces. It is found that the germination and expanding of the micro-cracks are caused by highly concentrated stress and strain as well as interaction between thermal cycling and creep.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2005年第10期81-83,共3页
Transactions of The China Welding Institution
基金
南京航空航天大学引进人才科研基金项目(S0462-061)
关键词
热疲劳寿命
球栅阵列
裂纹
热循环
Crack initiation
Crack propagation
Cracks
Creep
Electronics packaging
Failure (mechanical)
Optical microscopy
Reliability
Stress concentration
Thermal cycling
作者简介
薛松柏，男．1956年4月出生．工学博士．敦授．博士生导师。主要研究方向为新型焊接材料与工艺，微电子焊接．发表论文80余篇。Email：xuesb@nuaa.edu.cn
