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AZ91D镁合金的化学镀镍 被引量:17

ELECTROLESS Ni-P PLATING ON THE AZ91D MAGNESIUM ALLOY
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摘要 使用硫酸镍作为化学镀镍磷镀液的主盐,直接在AZ91D镁合金基体上化学镀镍.使用扫描电镜和X射线衍射技术分析镀层的表面形貌和组织.化学镀镍磷镀层是致密的,无明显缺陷,其磷含量约为3.72 mass%.化学镀镍磷镀层的显微硬度值约为660 VHN,化学镀镍的沉积速度为23μm/h.前处理过程中的酸洗步骤使镁合金基体产生粗糙的表面,从而使镀层和基体之间起到了互锁的作用,增加了镀层的结合力. Direct electroless Ni- P plating on the AZ91D magnesium alloy from a plating bath containing sulfate nickel was investigated. The morphology and microstructure of the electroless Ni - P coating was studied by using SEM and XRD. The electroless Ni - P coating was compact and no obvious defects. The hardness values of the Ni - P coatings were about 660 VHN and the phosphorus content of this coatifig was about 3.72 mass% The deposition rate of the electroless Ni - P alloy was about 23μm/h. The acid pickle pretreatment on the AZ91D magnesium alloy substrate provides surface pits to act as sites for mechanical interlocking to improve ad- hesion of the coating and the substrate.
出处 《中国腐蚀与防护学报》 CAS CSCD 北大核心 2005年第5期271-274,共4页 Journal of Chinese Society For Corrosion and Protection
关键词 化学镀 镁合金 AZ91D NI-P合金 electroless deposition, magnesium alloy, AZ91D, Ni - P alloy
作者简介 谷长栋,1978年生,男,山东济南人,硕士研究生,主要从事化学镀以及镁合金防腐蚀的研究
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参考文献13

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