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铜作化学镀铜催化剂研究 被引量:4

STUDIES ON COPPER USED AS CATALYST IN ELECTROLESS COPPER PLATING
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摘要 作者参考了大量文献,经过试验筛选,对用铜作化学镀铜催化剂作深入研究。对敏化活化的分步进行,敏化活化一步法的工艺流程和所用配方,以及提高铜催化活性和镀层结合强度的措施等提出了研究结果。并认为进一步研究改善用铜催化剂化学镀铜是可以逐步代替目前所用的贵金属催化剂,大大降低生产成本。 Studies on copper used as catalyst in electroless copper plating is carried out on basis of a lot of references and a series of tests. Research results on the process cycles including seperate step as well as one-step method of sensitization and activation, the bath composition used and the measures adopted to improve the catalyic activity of copper and adhesion strength of the coatings are given. It is considered that further study on copper catalyst would gradually lead to substituting copper for noble metal catalyst conventionally used in electroless copper plating and the cost would be much lower,
作者 徐本
出处 《电镀与环保》 CAS CSCD 1989年第5期1-4,共4页 Electroplating & Pollution Control
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  • 1董根岭,周完贞.TY-1型无锡(Ⅱ)胶体钯活化液的研制和应用[J].电镀与精饰,1993,15(3):25-26. 被引量:6
  • 2王丽丽.化学镀铜[J].电镀与精饰,1996,18(2):38-41. 被引量:10
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  • 6SHIPLEY M G,SHERBORN.Catalyst Solution for Electroless Deposition of Metal on Substrate[P].U.S:3874882,1995-04-20.
  • 7唐济才.盐基胶体钯活化液[J].电镀工业,1985,(7):1-7.
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  • 10IACOVANGELO C D. CHARLES D. Activation of refractory metal surfaces for electroless plating[P]. U.S: 4746375,1988-05-24.

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