摘要
加工超光滑表面的KDP晶体是现代超精密加工技术领域的重点研究课题。实验采用维氏压痕法研究KDP晶体脆性材料(001)面不同晶向的硬度、断裂韧性的变化规律。通过建立KDP晶体脆塑转变临界切削厚度模型,研究了KDP晶体金刚石切削脆塑转变机理。结果表明,脆塑转变临界最小切削厚度出现在断裂韧性最小而硬度最大的[110]方向;脆塑转变临界切削最大厚度出现在断裂韧性最大而硬度最小的[001]方向。并利用超精密机床加工了KDP晶体,加工结果与理论推导结论相符合,在[001]方向加工出表面粗糙度为7.5nm(RMS)的超光滑表面。
Machining KDP crystal with an ultra-smooth surface is a key subject in the field of modern ultra-precision machining. The variations in hardness and fracture toughness of different orientations on the (001) plane of KDP crystal are studied by means of Vickers indentation. Through establishing a model of critical cutting depth during the occurrence of brittle-ductile transition of KDP crystal, the mechanism of brittle-ductile transition of KDP crystal is studied. The study shows that the minimum critical turning thickness of brittle-ductile KDP transition appears in orientation [110] with minimum fracture toughness and maximum hardness. The maximum critical turning thickness of brittle-ductile KDP transition appears in orientation [001] with maximum fracture toughness and minimum hardness. The KDP crystal is machined by an ultra-precision machine tool. Experimental results are consistent with theoretical conclusion. An ultra-smooth surface with surface roughness of 7.5 nm (RMS) is machined in orientation [001].
出处
《光电工程》
EI
CAS
CSCD
北大核心
2005年第7期67-70,88,共5页
Opto-Electronic Engineering
基金
黑龙江省自然基金项目(E2004-26)
国家自然基金项目(50405011)
武器装备预言基金项目
关键词
KDP晶体
金刚石切削
超精密加工
断裂韧性
KDP crystal
Diamond cutting
Ultra-precision manufacture
Fracture toughness
