摘要
封装材料的热疲劳失效是封装器件失效的主要原因之一。对在微电子封装中应用很广的环氧模塑封装材料进行了常温和高温下的拉伸、疲劳实验。基于以疲劳模量作为损伤因子的疲劳寿命预测模型,相应的材料参数通过实验获得。并通过实验得出了该环氧模塑封装材料考虑温度影响的疲劳寿命预测模型,利用该模型可以对微电子封装用高聚物的疲劳寿命进行预测。
Thermo-mechanical fatigue failure of the packaging materials is one of the main causes for the microelectronic component failure. Tension and fatigue tests on a widely used packaging epoxy molding compound (EMC) were performed under room and high temperatures. A fatigue life prediction model based on fatigue modulus concept was applied and the related material parameters were obtained by the experiments. The temperature effect on the fatigue life of the EMC are considered. This provides the fatigue life prediction of the microelectronic packaging polymer.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2005年第5期49-51,54,共4页
Electronic Components And Materials
基金
国家自然科学基金资助项目(批准号:60166001)
关键词
电子技术
模塑封材料
拉伸实验
疲劳实验
疲劳寿命预测
electronic technology
epoxy molding compound
tension test
fatigue test
fatigue life prediction
