摘要
采用树脂膜/离型纸的T型剥离实验方法来表征RFI树脂膜操作过程中的揭取特性,实验研究了几种基本RFI树脂膜的T形剥离载荷 位移关系在不同加载速度及不同实验温度下的表现形式。结果显示内聚破坏与界面破坏情况下载荷位移曲线有明显不同的形式。提高温度有利于出现内聚破坏,而提高实验速度则易于出现界面破坏。进一步从实验数据总结出树脂膜揭取的工艺范围应当在出现界面破坏的温度范围内。
T-peel test is used to characteristic the separation processes of resin film from release paper. Load-displacement behavior of some elementary resin films in T-peel test processes used in RFI technology are investigated at various loading rates and test temperatures. The results show that the load-displacement curves of cohesive failure differ much from that of interface failure. It prefers cohesive failure at high temperature, otherwise it tend to interface failure at high loading rate. It is deduced that the available processes for resin film separated from release paper is limited in the temperature range which appears as interface failure at T-peel test.
出处
《材料工程》
EI
CAS
CSCD
北大核心
2005年第3期43-47,共5页
Journal of Materials Engineering
