摘要
以印制电路板的电磁兼容性为核心,分析了电磁干扰的产生机理,详细介绍了在设计、装配印制电路板时的抗干扰措施。
The mechanism of EMI is analyzed, and the anti-interference measures of the PCB in design and assemble are amply introduced with the core of EMC.
出处
《电子工艺技术》
2005年第2期92-94,共3页
Electronics Process Technology
