摘要
利用IR、SEM等手段,较详细地研究了铜粉–环氧树脂体系中固化剂与铜粉的相互作用,并探讨了铜粉用量、形状对涂料导电性能的影响规律。结果表明:固化剂(最佳用量为20%左右)可以通过形成配合物的反应,有效除去铜粉表面的氧化物,极大改善涂料导电性,使填充75%铜粉的体系具有约0.2×104Ω·m的体积电阻率。应用渗流模型和导电通道理论分析铜粉的用量、形状对涂料导电性能的影响规律。
In the preparation of conductive paints of epoxy resin filled with copper powders the reaction between the curing agent and copper was studied in detail by means of SEM and IR. The analysis indicates that the curing agent can remove the oxide on the surface of the copper powder ensuring the paints filled with 75% of copper powder high conductivity of 0.2×10-4Ω·m. The relationship between the shape and content of the copper powders and the conductivity of the paints are discussed, and the results are explained by related theory.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2004年第12期40-42,46,共4页
Electronic Components And Materials
关键词
有机高分子材料
导电涂料
导电性能
环氧树脂
铜粉
固化剂
organic polymer materials
conductive paint
conductivity
epoxy resin
copper powder
curing agent
