摘要
结合TMS320C6201DSP印刷电路板制作中的实际经验,阐述了外形与布局、电源与接地、电路灵活性等设计规则,重点说明了DSP分层布线方法及EMI滤波器的原理与设计,分析了多层高速电路PCB设计中有关可靠性、电磁兼容性等设计方面一些值得考虑的问题并提出了相应的防止和抑制电磁干扰的方法.
Based on the practical experience in PCB design using TMS320C6201 DSP, the design regulations of profile, layout, power, ground and flexibility are described. The method of DSP layout and the principle of EMI filter are explained. Analyzed the reliability and EMC problems in high-speed multilayer PCB design are analyzed, and solutions to these problems are provided.
出处
《应用科技》
CAS
2004年第11期19-20,共2页
Applied Science and Technology
