摘要
针对陶瓷DIP外壳钎焊时,常出现AgCu28钎料流淌的问题,而钎料铺展性对钎料的流淌起着重要作用,为此研究了在不同的生产工艺条件下,AgCu28共晶钎料在镀有不同厚度镍的金属化陶瓷基板和4J42可伐合金片上的铺展性.结果显示钎料在化学镀镍层上比在4J42合金带上的铺展面积大,并存在一个临界镀镍层厚度(0.5～1.0 μm),超过这一临界值,铺展面积显著下降.钎料铺展面积随着焊接温度、时间而改变,控制在钎料熔点以上的停留时间是减少钎料过分铺展的关键.
The AgCu28 liquid filler often flows onto the surface of the leadframe and the sealedring in ceramic DIP manufacture. These problems are mostly caused by the spreading of the filler. The spreading behavior of AgCu28 filler on 4J42 alloys and metallized ceramic substrate with different thickness of electroless nickel plating had been studied in various brazing processes .The results show that the spreading area on electroless nickel plating is larger than that on 4J42 alloys. There is a critical thickness of electroless nickel plating(about 0.5~1.0 靘)and the spreading area will decline greatly when the critical thickness is exceeded. The spreading area is related to the temperature and the hold time in brazing furnace, and the key to avoid exceptional spreading is controlling the hold time at the temperature above the melting point.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2004年第8期36-38,共3页
Electronic Components And Materials
