摘要
时间/压力型流体点胶技术在半导体封装过程中有着广泛的应用。由于胶液的非牛顿特性和点胶过程的时变特性,很难建立精确实用的点胶模型。本文通过分析过程参数(胶体体积)变化对系统性能的影响,提出了点胶过程分段变参数模型,并利用该模型对实际点胶系统进行了分段控制。仿真和实验验证了模型与控制的有效性。
Time-pressure dispensing technology is widely used in semiconductor packaging. However,it is difficult to model the dispensing process due to the non-Newtonian fluid and time-variant parameters. Based on analysis of the process parameter,an integrated dispensing process model and a segmented control strategy are proposed in the article. Experimental results demonstrate the effectiveness of the model and control for the varied parameter dispensing process.
出处
《装备维修技术》
2007年第3期16-18,共3页
Equipment Technology
关键词
点胶系统
半导体封装
建模
控制
dispensing system
semiconductor packaging
model
control
