摘要
以国产银钎剂QJ102的原料配方为基础,用硼酸代替硼酐,运用正交试验法对银钎剂[w(KF)为33%+w(KBF4)为18%+w(H3BO3)为49%]的球磨工艺进行研究,获得了最优的球磨工艺参数:球磨时间t=1.5h,球磨速度v=400r/min,球料比λ=2:1。在不改变钎剂主要成分的基础上加入质量分数为0.5%～2.0%的硅油、0.5%～2.0%的A醚进行改性处理。结果表明,改性后的银钎剂为膏状,黏度大,长期放置不会结块变硬,焊后残留物少,性能指标达到国外样品水平。
Based on the formula of the existing QJ102 silver brazing flux,the ball-milling process research was carried out with new compositions and formula of [w(KF) of 33% +w(KBF4) of 18%+w(H3BO3) of 49%] by the orthogonal experiment method.The optimal ball-milling process parameters are:proportion of ball to stuff is 2:1,the rotation speed is 400r/min and the milling time is 90 min.Silicone oil and A ether was added in the new formula for improvement properties.The result shows that the silver brazing flux after i...
出处
《电子元件与材料》
CAS
CSCD
北大核心
2010年第8期51-53,共3页
Electronic Components And Materials
关键词
银钎剂
球磨法
添加剂
silver brazing flux
ball-milling method
additives
