摘要
采用硅偶联剂对TR组件(陶瓷电路板)表面进行改性处理,使得陶瓷电路板中的金属材料与聚四氟乙烯极性相近,通过射频磁控溅射在TR组件表面制备出聚四氟乙烯薄膜。XPS,SEM测试表明薄膜主要组成为聚四氟乙烯组分,薄膜形貌均一、致密。
It is the study that prepare PTFE film in Surface of ceramic circuit board.Surface of ceramic circuit board is modified by resin acceptor,for the polarity of the metal material of ceramic circuit board is similar to PTFE.The essential component of the film is PTFE by testing of XPS and SEM,and the film is equal and compact.
出处
《真空与低温》
2007年第4期195-197,233,共4页
Vacuum and Cryogenics
基金
真空低温技术与物理国家级重点实验室基金(9140C550201060C55)
关键词
陶瓷电路板
四氟乙烯薄膜
磁控溅射镀膜机
偶联剂
亲水性
疏水性
china circuit board
PTFE film
coating machine of magnetron sputtering
resin acceptor hydrophilicity
hydrophobicity
作者简介
张剑锋(1978-),男,陕西省咸阳市人,工程师,从事纳米材料研究和材料表面分析工作.
