摘要
为提高高硅铝合金电子封装材料的使用性能,对Al-12Si与Al-30Si合金粉末进行300℃空气氧化,热挤压制备出Al2O3与SiO2增强的弥散强化型铝硅复合材料,通过光学显微镜及电子万能试验机对材料显微组织、抗拉强度、抗弯强度及拉伸断口形貌进行了分析。结果表明:合金粉末经高温空气氧化后,Al-12Si晶粒长大不明显,而Al-30Si晶粒发生了明显长大;Al-30Si复合材料的抗拉强度及抗弯强度均明显高于Al-12Si,且均随氧化时间延长而提高,粉末氧化32 h后,Al-30Si材料抗拉强度与抗弯强度高达291 MPa与378 MPa,比未氧化的分别提高了33.5%与32.2%;材料的断裂方式随着氧化时间延长而变化,由单纯的韧性断裂逐渐向韧性与脆性共存的混合断裂转变。
In order to improve properties of high-silicon aluminum alloy electronic packaging materials,300 ℃ air oxidation was applied to Al-12Si and Al-30Si alloy powders,SiO2 and Al2O3 dispersion strengthened composites were fabricated.The microstructure,tensile and bend strength were examined by means of optical microscopy and electronic versatile tester.After strength oxidation,the growth of Si grains in Al-30Si is more obvious than that of Al-12Si.The tensile strength and bend strength of Al-30Si material are hi...
出处
《机械工程材料》
CAS
CSCD
北大核心
2008年第3期57-60,共4页
Materials For Mechanical Engineering
基金
江苏省高新技术产业化资助项目(JH01-071)
关键词
高硅铝合金
电子封装
高温氧化
热挤压
high-silicon aluminum alloy
electronic packaging
high-temperature oxidation
hot extrasion
