摘要
基于微波光子混合封装技术,制备了多通道解复用光/电(optical-to-electrical,O/E)转换组件。将光芯片、微波芯片、空间透镜、微波电路进行一体化混合封装在同一壳体内,使得组件具备解波分复用、O/E转换、微波处理等多种功能,从而实现将1路波分复用的光载射频信号解调至6路射频(radio frequency,RF)信号并放大后对外输出。多通道解复用O/E转换组件包含了解复用器、聚焦透镜、光电探测器(photodetector,PD)、微波放大器、均衡器以及电源等多专业裸芯片,利用混合集成封装技术,极大缩减了产品的尺寸,提高了集成度和复杂度,在大容量微波光子应用领域中具有极大潜力。通过对制备的O/E转换组件进行测试,结果表明该组件可实现光载射频信号到RF信号的宽带转换,光电转换效率在0.7 A/W以上。同时测试了O/E转换组件的幅频特性,S21均值为-8.4 dB,在通带内波动范围在±3.5 dB之间,驻波反射小于2 dB,且通道间隔离度达到40 dBc以上。
Based on microwave photonic hybrid-packaging technology,a multichannel demultiplexed optical-to-electrical(O/E)conversion module is fabricated.Optical chip,microwave chip,free-space lens,and microwave circuit are packaged in a cavity,making the module combine the function of demultiplexing,O/E conversion and microwave processing to achieve the conversion from 1-channel multiplexed radioover-fiber signal to 6-channel radio frequency(RF)signal and to output the signal after amplifying.The multichannel demultiplexed O/E conversion module is composed of several bare chips such as demultiplexer,focusing lens,photodetector(PD),microwave amplifier,equalizer,and power supply,which utilizing hybrid integrated packaging technology to greatly reduce the size of the module and improve integration and complexity of the module.The module shows huge potential in application of multi-functional microwave photonic area.The test results show that the module can realize the broadband conversion between radio-over-fiber signal to RF signal,and the efficiency of the O/E conversion exceeds 0.7 A/W.In addition,the test results of the amplitude-frequency characteristics show that the mean value of S21 is-8.4 dB,with a fluctuation of±3.5 dB.The test results also show that the reflection of standing wave is less than 2 dB,and the isolation degree between adjacent channels is above 40 dBc.
作者
许玮华
吕晓萌
廖翱
伍艺龙
张童童
李希斌
XU Weihua;LV Xiaomeng;LIAO Ao;WU Yilong;ZHANG Tongtong;LIXibin(The 29th Research Institute of China Electronics Technology Group Corporation,Chengdu,Sichuan 610036,China;Sichuan Province Engineering Research Center for Broadband Microwave Circuit High Density Integration,Chengdu,Sichuan 610036,China)
出处
《光电子．激光》
CAS
CSCD
北大核心
2022年第10期1031-1037,共7页
Journal of Optoelectronics·Laser
关键词
微波光子
混合封装技术
解波分复用
光/电(O/E)转换
microwave photonic
hybrid-packaging technology
wavelength division demultiplexing
optical-to-electrical(O/E)conversion
作者简介
吕晓萌(1986-),男,博士,高级工程师,主要研究方向为光子信息技术,包含光电子芯片、微波光子混合集成技术以及数字/射频类光系统的研发设计,E-mail:342721062@qq.com
