摘要
LED结温严重影响其可靠性和性能,LED芯片的结温升高,会使芯片的寿命减少,性能衰退。本文使用有限元法和ANSYS软件,建立了1W LED灯珠的仿真模型,验证了模型的可靠性;仿真计算的LED灯珠最高温度为334K,稳态情况下的灯珠温度分布呈正态分布,与实测结果基本一致。与文献报道方案相比,本仿真的最大优势是保持精度、有效减小了计算时间,对大型LED模组仿真方案具有一定的参考价值。
The reliability and performance of LED largely depend on junction temperature,which increases the junction temperature of the LED chip,which will reduce the life of the chip and degrade its performance.This paper establishes the simulation model of 1W LED beads for heating element.Based on the finite element method and ANSYS software,the temperature distribution under steady state is obtained.The simulation results under rated working conditions are compared with the measured temperature.The difference is within the allowable error range,which verifies the reliability of the model.The simulation results can accurately reflect the temperature of the LED beads.
作者
李磊
严其艳
马丽心
阳颂兵
Lei;YAN Qi-yan;MA Li-xin;Yang Song-bin(School of Mechanical and Electrical Engineering,Guangdong University of Science and Technology,Dongguan 523668,China;Dongguan Baifenbai Technology Co.,Ltd Dongguan 523126,China)
出处
《功能材料与器件学报》
CAS
2023年第3期210-213,共4页
Journal of Functional Materials and Devices
基金
东莞市科技特派员项目(No.20221800500782)
关键词
LED
灯珠
温度分布
数值模拟
LED
Lamp Beads
Temperature Distribution
Numerical Simulation
作者简介
李磊(1989—),男,硕士,讲师,主要研究方向为新型电力电子技术(E-mail:904468001@qq,com).
